Sehyeon Cho received his B.S. in Mechanical Engineering (2021) and M.S. in Intelligent Energy and Industry (2024) from Chung-Ang University, South Korea. He then worked as a 3D IC process integration engineer in the Advanced Research Team of the Semiconductor R&D Center at Samsung Electronics. He is currently pursuing a Ph.D. in Mechanical Engineering at Purdue University, supported by the Ross & Engineering Fellowship, and co-advised by Prof. Amy Marconnet and Prof. Tiwei Wei. His research interests include nanoscale to macroscale heat transfer, semiconductor fabrication processes, and 3D interconnect technologies.

LinkedIN: https://www.linkedin.com/in/sehyeon-cho-623579286/