We are proud to share a historic milestone for our group!
Our very first PhD student, Dr. Shuhang Lyu, co-advised with Prof. Thomas Beechem, has successfully passed his final PhD defense.
His dissertation, “Understanding Thermomechanical Response of Scaled Through Silicon Vias for High-Density 3D Packaging,” provides important insights into reliability challenges in next-generation microelectronic systems.
During his PhD, Dr. Lyu made significant contributions to the field of advanced packaging, including:
- Developing micro/nano-fabrication processes for high-aspect-ratio, void-free through-silicon vias (TSVs) down to sub-micron scales
- Establishing combined experimental–modeling frameworks (Raman spectroscopy, SEM/EBSD, and FEM) to characterize stress and reliability in TSVs
- Advancing thermomechanical reliability modeling using COMSOL and ANSYS
- Revealing scaling effects on TSV microstructure and mechanical behavior, featured as a cover article in J. Appl. Phys. (2025)
His work has resulted in multiple journal publications (e.g., J. Appl. Phys., IEEE CPMT, Flow) and conference presentations at leading venues including IEEE ECTC and IEEE ITHERM, along with recognition such as the Best Student Presentation Award (IEEE REPP 2022).
We sincerely thank the advisory committee—Prof. Zhihong Chen, Prof. Amy Marconnet, and Prof. Liang Pan—for their time, guidance, and valuable feedback. We also thank all members of our group for their continuous support and collaboration.
Congratulations to Dr. Lyu on this remarkable achievement and on being the first PhD graduate from our group—we are excited to see all that he will accomplish next!
