We are delighted to share that Dr. Zhengwei Chen has successfully passed his PhD public defense. He has been co-advised by Prof. Tiwei Wei and Prof. Amy Marconnet throughout his doctoral studies.
Dr. Chen’s research has advanced the field of thermal management for next-generation heterogeneous integration and 3D packaging systems, addressing key challenges in heat spreading, hotspot mitigation, and thermal isolation for densely integrated electronics.
Major Contributions of His Dissertation
- Developed novel process flows and architectures for thermal management in advanced heterogeneous integration systems.
- Established an integration process for polycrystalline diamond at die-to-die interfaces to enhance heat dissipation.
- Proposed a Glass Bridge architecture for CMOS-compatible in-plane thermal insulation in silicon-based 2.5D systems.
- Designed and implemented a dual-chip TTV platform for thermal characterization and performance evaluation.
- Demonstrated the integration of aerogel materials into 3D systems for localized hotspot-targeted thermal insulation.
We sincerely thank his dissertation committee members, including Prof. Jeffery P. Youngblood and Prof. Steven Wereley, for their time, insights, and support. We also gratefully acknowledge the support of the DARPA MiniTherms3D Program, which made this work possible. Please join us in congratulating Dr. Chen on this important milestone and wishing him continued success in his future endeavors.
